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Funded Projects › H2020

WAKeMeUP · Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors

H2020Status: CLOSED1 May 201831 August 2021EU funding €24,112,728Call H2020-ECSEL-2017-1-IA-two-stage

The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains.The already defined microcontrollers with 40nm embedded flash technology will be consolidated to build a solid manufacturing platform. Additional developments will be performed for the integration of memory, power management, connectivity, hard security on the same chip.The project will also target the industrialization of the embedded Phase Change Memory (PCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM will be driven by the final application requirements as well as decreasing the power consumption.The alternative memory solutions will be also studied as they have different - and complementary - traits in such areas as read/write speed, power and energy consumption, retention and endurance, and device density and benchmarked with the ePCM and the conventional eFlash. Continued advances in materials, device physics, architectures and design could further reduce the energy consumption of these memories.To achieve this goal of generating high value added semiconductor circuits in Europe in a breakthrough leading edge technology the project will deploy all the necessary activities to bring a new technology to an early industrial maturity stage. These activities encompass such developments as: technology enhancements for various specific application requirements such as wide temperature range and reliability, high security requests, high flexibility…, design enablment allowing first time silicon success, prototyping demonstrator products in the different application areas.In the WAKEMEUP project, new devices and systems will be developed by the application partners in automotive and secure based on FD-SOI and embedded digital technology to answer specific applications needs.

Consortium · 20 organisations

coordinator

STMICROELECTRONICS CROLLES 2 SAS

FR · €8,308,999

participant

STMICROELECTRONICS FRANCE

FR · €742,818

participant

PFEIFFER VACUUM

FR · €144,066

participant

STMICROELECTRONICS (GRAND OUEST) SAS

FR · €931,084

participant

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV

DE · €1,101,131

participant

THALES COMMUNICATION & SECURITE NUMERIQUES SA

FR · €210,124

participant

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

FR · €9,268,019

participant

INSTITUT MIKROELEKTRONICKYCH APLIKACI SRO

CZ · €54,844

participant

TURKIYE BILIMSEL VE TEKNOLOJIK ARASTIRMA KURUMU

TR · €295,531

participant

USTAV TEORIE INFORMACE A AUTOMATIZACE AV CR VVI

CZ · €112,000

participant

STMICROELECTRONICS ROUSSET SAS

FR · €676,863

participant

CONTINENTAL TEVES AG & CO OHG

DE · €257,250

thirdParty

X-FAB FRANCE

FR

thirdParty

UNIVERSITE GRENOBLE ALPES

FR

participant

X-FAB Dresden GmbH & Co. KG

DE · €197,373

participant

MELEXIS GMBH

DE · €317,000

participant

TECHNISCHE UNIVERSITAT DARMSTADT

DE · €238,552

participant

UNIVERSITAT AUTONOMA DE BARCELONA

ES · €211,495

participant

STMICROELECTRONICS GRENOBLE 2 SAS

FR · €390,707

participant

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS

FR · €654,875

Research fields

View the official record on CORDIS →

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Source: CORDIS, Publications Office of the European Union. Global Research Partnerships surfaces open EU research data to help you find collaborators; we are not affiliated with the European Union.