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Funded Projects › FP7

THERMINATOR · Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future

FP7Status: CLOSED1 January 201031 December 2012EU funding €6,293,810

Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and device breakdown. To complicate the picture, electronic components tend to get warmer on their own as they operate, due to the fact that the power drawn by the devices from the power supply is dissipated by Joule effect.<br/>As time passes, heat and temperature management is becoming increasingly problematic, for reasons ranging from economical to technological. Packages that are able to sustain high temperatures are very expensive, and so are heat-sinks and cooling systems. In addition, high operating temperatures tend to cause malfunctioning of circuits and components, thus impacting the reliability of the electronic products which incorporate such devices.<br/>The development of new, thermal-aware design paradigms can no longer be postponed if the goal is to enable designers to fully exploit the electronic technologies of the future, being those CMOS or alternative to CMOS.<br/>The thermal problem has several facets, thus it needs to be addressed in a comprehensive manner. The THERMINATOR projects will address the following major challenges: 1) To devise innovative thermal models usable at different levels of abstraction, and to interface/integrate them into existing simulation and design frameworks. 2) To develop new, thermal-aware design solutions, customized for the different technologies and application domains of interest. 3) To enhance existing EDA solutions by means of thermal-aware add-on tools that will enable designers to address temperature issues during their daily work and with their usual design flows.

Consortium · 21 organisations

coordinator

STMICROELECTRONICS SRL

IT · €781,482

participant

ST-POLITO Societa' consortile a r.l.

IT · €59,526

participant

KNOWLES ELECTRONICS AUSTRIA GMBH

AT

participant

CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT

CH · €249,418

participant

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV

DE · €309,992

participant

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

FR · €500,636

participant

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

BE · €490,171

participant

INFINEON TECHNOLOGIES AG

DE · €281,550

participant

BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM

HU · €253,100

participant

SYNOPSYS SWITZERLAND LLC

CH · €206,500

participant

INTEL DEUTSCHLAND GMBH

DE · €522,613

participant

NXP SEMICONDUCTORS GERMANY GMBH

DE · €495,951

participant

OFFIS EV

DE · €598,228

participant

NXP SEMICONDUCTORS NETHERLANDS BV

NL · €410,966

participant

MUNEDA GMBH

DE · €260,000

participant

POLITECNICO DI TORINO

IT · €504,225

participant

ALMA MATER STUDIORUM - UNIVERSITA DI BOLOGNA

IT · €300,052

participant

Synopsys Armenia CJSC

AM · €69,400

participant

NXP SEMICONDUCTORS GA GMBH

DE

participant

ChipVision Design Systems AG

DE

participant

GRADIENT DESIGN AUTOMATION, INC. - GDA

US

Research fields

View the official record on CORDIS →

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