ELSAH · Electronic smart patch system for wireless monitoring of molecular biomarkers for healthcare and well-being

ELSAH realizes a flexible and integrated, smart patch-based, wearable sensor system for continuous monitoring of health and well-being that quantifies biomarkers by electrochemical detection. This system will be fully self-sustained by integrating microneedle biosensors with a microchip, a printed battery and printed electronics, thereby enabling independent measurements and secure wireless data transmission to the user’s mobile phone. The ELSAH-patch will comprise: 1) Simultaneous electrochemical quantification of glucose and lactate concentrations in the interstitial fluid; 2) Total monitoring period of at least 24 hours at a measurement interval of no more than 5 minutes; 3) Total patch area of no more than 16 cm2 at a maximum patch thickness of 4 mm; 4) Choice of components and integration process that enable fabrication costs of a post-project commercial version of no more than 2 € per patch. We will realize three generations of the ELSAH-patch system with consecutively increasing integration levels. The first generation will be a platform system assembled from interchangeable standard components, while the last generation will provide the final modular solution which integrates advanced components and interfaces.To achieve the objectives, the ELSAH consortium unites the individual innovative strengths in advanced electronics technologies of five research, three SME and two large industry partners. They will generate added value by jointly developing an entirely new integrated bio-electronic smart system with strong market potential, thereby supporting the digitisation of Europe’s industry.The ELSAH-patch constitutes a new ESS generation that will enable for the first time the cost-effective and minimally invasive self-testing of molecular biomarker levels by integrating individual hardware technologies across multiple fields, namely: 1) Polymeric microneedles manufacturing; 2) Electrochemical biosensors; 3) Printed electronics; 4) Advanced processing.