Founding offer · lifetime membership for a single £24, exclusive to our first members · closes 20 June Claim your place →
Global Research Partnerships £24 Lifetime Log inCreate free account

Funded Projects › H2020

Caladan · Micro assembled Terabit/s capable optical transceivers for Datacom applications

H2020Status: CLOSED1 January 201931 December 2023EU funding €5,846,729Call H2020-ICT-2018-20

Data centers which underpin the Cloud are under pressure. As the capacity of data center servers is growing, so must the capacity of the links between those servers. Industry foresees a need for high volumes of 800Gb/s and 1.6Tb/s transceivers by 2025. Today, despite the use of complex Photonic Integrated Circuits (PICs), manufacturing an optical transceiver still requires a large number of sequential steps. This is because lasers and electronic chips need to be assembled on a piece-by-piece basis onto the PIC. The resulting optical engine then needs to be coupled to a fiber array and packaged. These steps are done sequentially, creating a bottleneck in the manufacturing line which makes it hard to scale up production and reduce cost. CALADAN will demonstrate how integration of lasers and electronics onto a PIC can be done fully at the wafer-level using the established micro transfer printing technique, thus eliminating this bottleneck. GaAs quantum dot lasers and 130nm SiGe BiCMOS 56Gbaud capable driver and receiver electronics will be transfer printed onto Silicon Photonic 300mm wafers. Starting from proven concepts in PIXAPP, a novel fast fiber attachment process will be demonstrated that reduces the time required for fiber attachment by an order of magnitude. Using these techniques, transceiver cost will be 0.1Euro/Gb/s for volumes of at least 1,000,000 units.The consortium, which consists of three SMEs (X-Celeprint, Innolume and ficonTEC), an LE (EVGroup), three research institutes (IMEC, Tyndall and IHP), a transceiver manufacturer (Mellanox) and a multinational (Xilinx) encompasses all the partners to start production of the targeted optical transceivers after the end of the project. Exploitation of the technology will be supported by an end-user (British Telecom), a semiconductor foundry setting up a micro transfer printing Pilot Line (MICROPRINCE, X-FAB), an optical equipment manufacturer (ADVA) and the European Photonic Industry Consortium (EPIC).

Consortium · 10 organisations

coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

BE · €2,547,369

participant

IHP GMBH - LEIBNIZ INSTITUTE FOR HIGH PERFORMANCE MICROELECTRONICS

DE · €1,012,500

participant

EV GROUP E. THALLNER GMBH

AT · €256,375

participant

X DISPLAY COMPANY TECHNOLOGY LIMITED

IE · €17,769

participant

X-CELEPRINT LIMITED

IE · €467,856

participant

INNOLUME GMBH

DE · €355,163

participant

MELLANOX TECHNOLOGIES LTD - MLNX

IL · €322,954

participant

XILINX IRELAND UNLIMITED COMPANY

IE · €71,313

participant

FICONTEC SERVICE GMBH

DE · €323,925

participant

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK

IE · €471,506

Research fields

View the official record on CORDIS →

← Find collaborators and more funded projects

Source: CORDIS, Publications Office of the European Union. Global Research Partnerships surfaces open EU research data to help you find collaborators; we are not affiliated with the European Union.